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Dual, Unipolar/Bipolar, High-Voltage
Digital Pulsers
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
V DD Logic Supply Voltage........................................-0.3V to +6V
V CC_ Output Driver Positive Supply Voltage ..........-0.3V to +15V
V EE_ Output Driver Negative Supply Voltage.........-15V to +0.3V
V PP_ High Positive Supply Voltage.......................-0.3V to +230V
V NN_ High Negative Supply Voltage ....................-230V to +0.3V
V SS Voltage ................................................(V PP_ - 250V) to V NN_
V PP1 - V NN1 , V PP2 - V NN2 Supply Voltage............-0.6V to +250V
INP_, INN_, INC_, EN_, SHDN Logic Input...-0.3V to V DD + 0.3V
O P_, O CP_ , O LN_ , O N_ ..............(-0.3V + V NN_ ) to (-0.3V to V PP_ )
C GN_ Voltage............................(-0.3V + V NN_ ) to (+15V + V NN_ )
C DC_, C DP_ , C DN_ Voltage......................................-0.3V to V CC_
Peak Current per Output Channel ........................................3.0A
Continuous Power Dissipation (T A = +70°C) (Note 1)
56-Pin TQFN (derate 40mW/°C above +70°C) ..........3200mW
Thermal Resistance (Note 2)
θ JA ................................................................................25°C/W
θ JC ...............................................................................0.8°C/W
Operating Temperature Range...............................0°C to +70°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
C GP_ Voltage .............................(+0.3V + V PP_ ) to (-15V + V PP_ )
C GC_ Voltage...........................................................-15V to +15V
Note 1: This specification is based on the thermal characteristic of the package, the maximum junction temperature, and the setup
described by JEDEC 51. The maximum power dissipation for the MAX4810/MAX4811/MAX4812 might be limited by the thermal
protection included in the device.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V DD = +2.7V to +6V, V CC_ = +4.75V to +12.6V, V EE_ = -12.6V to -4.75V, V NN_ = -200V to 0, V PP_ = 0 to (V NN_ + 200V), V SS ≤ the lower of
V NN1 or V NN2 , T A = T J = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Note 3) (See Figures 8, 9, and 10.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY (V DD , V CC_ , V EE _, V PP_ , V NN_ )
Logic Supply Voltage
Positive Drive Supply Voltage
Negative Drive Supply Voltage
High-Side Supply Voltage
Low-Side Supply Voltage
V PP_ - V NN_ Supply Voltage
V DD
V CC_
V EE_
V PP_
V NN_
+2.7
+4.75
-12.6
0
-200
0
+3
+12
-12
+6
+12.6
-4.75
V NN_ +
220
0
+220
V
V
V
V
V
V
SUPPLY CURRENT (Single Channel)
V INN_ /V INP_ = 0 , V SHDN = 0
1
V DD Supply Current
I DD
V EN_ = V DD , V SHDN = V DD , V INC_ = 0 or V DD ,
V INN_ = V INP_ , f = 5MHz
V SHDN = 0, CH1 and CH2
V EN_ = V DD , V SHDN = V DD, CH1 and CH2
100
130
200
1
200
μA
μA
V EN_ = V DD , V SHDN = V DD , V INC_ = 0 or V DD ,
V CC_ Supply Current
I CC_
V INN_ = V INP_ , f = 5MHz, V CC_ = 5V, V DD = 3V,
only one channel switching
V EN_ = V DD , V SHDN = V DD , V INC_ = 0 or V DD ,
15
mA
V INN_ = V INP_ , f = 5MHz, V CC_ = 12V, V DD = 3V,
only one channel switching
36
2
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